Diamond Sawing & Potting

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Complementary services such as substrate dicing and encapsulation are also available. Diamond sawing of ceramic substrates is utilized for singulation of very small parts, for tight dimensional tolerances, and where square substrate edges are required. Potting, or encapsulation, is used in applications where a hybrid needs to be isolated from the environment. A single surface-mounted component can be protected or the complete hybrid assembly can be sealed within a plastic shell.