Assembly - Wire Bonding

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Circuit populating is one of the variety of assembly services offered. Semiconductor die are attached to the substrate surface and connection to the circuit is made through wire bonding. Wire bonding is often used for other interconnections. Pull strengths are measured as required. Other types of bonding are available including ribbon bonding, wedge and ultrasonic bonding. (For packaged semiconductor mounting please go to 'Assembly - surface mounting' page.)