Assembly
- Surface Mounting|
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- Surface Mounting |
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| Circuit populating is one of the variety of assembly services offered. Passive components and packaged active devices are mounted on the circuit surface using solder reflow technology. The process involves printing solder paste onto the circuit pattern, pick & place of components, and solder reflow utilizing a belt oven. Ceramics, PCBs, and 'soft boards' can be populated. (For unpackaged semiconductor die attach please go to 'Assembly - wire bonding' page.) | |||