Thick Film Circuit Design Guidelines
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HTI Thick Film Design Guidelines
Dimensions are in inches unless otherwise stated.
-Al2O3 (Alumina 96%, 99.6%)
-ALN (Aluminum Nitride) BeO (Beryllium Oxide)
-BeO (Beryllium Oxide)
|10, 15, 25, 30, 40, 50, 60 mils +/-.005
Other thickness can be achieved by way of lapping
|Line Width (min.)
Al203, ALN, BeO, Ferrite
|Space Width (min.)||0.006|
|Thickness (typ.)||8-12 + microns/layer|
|Pull back (from diced edges, min.)||0.004, 0.010, 0.004|
|Pull back(from scribed edge, min)||0.004, 0.010, 0.004|
|Pull back (from edge of dielectric, min.)||0.004, 0.010, 0.004|
|Alignment (front to back)||0.004-0.008|
|Line Width (min)||0.10-0.005|
|Minimum width relative to conductor width||0.010 less, centered|
|Minmim Overlap With Conductor||0.005 0.003|
|Minimum Value||as low as 1mΩ|
|Maximum Value||1 GΩ or higher|
|Multiple Resistors (on one side of chip)||Yes, parameter defined|
|Typical Tolerance (value)||1%, 2%, 5%, 10%|
|Minimum Chip Size||0.050x 0.050|
|Vias (filled or plugged through holes)|
|Diameter (min, max)||0.005, 0.20
depending on board & thickness
|Minimum metal overlap of pads||0.010|
The experienced team at Hybrid-Tek will work closely with you on your hybrid program from start to finish - from circuit design and layout assistance through final package assembly, testing, documentation and delivery - or any stage in between. You will have the assurance of the highest possible quality with 100% useful parts. Hybrid-Tek, Inc. has been setting the standard and leading the industry for 20+ years.
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