Thick Film Manufacturing Capabilities
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Thick Film Circuit Fabrication
| Standard Processes | Description |
|---|---|
| Print & Fire | Circuit Fabrication |
| Metalizing | Types of Metalizing |
| Layers: | |
| -Single-Layer | CONDUCTORS |
| -Multi-Layer | Au, Pt, PtAu, PdAu, PtPdA |
| -Double Sided | Ag, PtAg, PdAg, PtPdAg |
| Plated-thru Vias / Hole | Connection top to bottom circuitry or to ground |
| Solid-filled Vias / Hole | Connection top to bottom circuitry or to ground |
| Dielectric | Protection for underlying circuitry |
| Edge Plating / Printing | Connection to surface mount resistors |
| Thick Film Printed Resistors | Alternative to surface mount resistors |
| Overglaze | Protection for underlying circuitry |
| Ceramic Standard Substrates | Surface Finish |
| 91% Alumina | As Fired, Lapped, Polished |
| 92% Alumina | As Fired, Lapped, Polished |
| 96% Alumina | As Fired, Lapped, Polished |
| 99.6% Alumina | As Fired, Lapped, Polished |
| Aluminum Nitride (Aln) | Lapped, Polished |
| Beryllium Oxide (BeO) | As Fired, Lapped |
| Specialty Substrates | Surface Finish |
| Ferrite | Lapped, Polished |
| Glass | Lapped, Polished |
| Macor | Lapped, Polished |
| Quartz | Lapped, Polished |
| Substrate Processing | Info |
| Laser Scribe | Single / Array |
| Laser Drill | Vias / Holes |
| Laser Machining | Per Specification |
| Diamond Saw Cut | +/- .002" Tolerance |
| Assembly | Ceramic, PCB, other board types |
| Surface Mount (SMT):
-Conductive, Non Conductive epoxy -Solder reflow -Solder lead / pin attachment |
Circuit population using active & passive components |
| Wire Bonding | Die attach circuit populationg-semiconductors |
| Gold ball | .001"-.003" mil wire |
| Gold wedge | .0005"-.003" mil wire |
| Aluminum wedge | .001"-.003" mil wire |
| Product Testing/Measurement | On HTI-Produced Units |
| Physical Dimensions(ceramic) | Verify conforming to customer specification |
| Continuity / Netlist Connection integrity | Resistor Measurement Value verification / Data Recorded |
| Metallization Adhesion | Leach resistance (verify adhesion) |
| Trace Thickness & Width (conductor, etc) | Verify conforming to customer specification |
| Wire Bond Qualification / Pull Testing | Bond strength |
| Wire Bond Qualification / Shear Testing | Bond strength |
| Burn-in | Circuit stabilization |
| Performance | Design confirmation |
| Environmental | Endurance verification |
| Leak Testing Using Fluid | Verify Hermetic seal |
| Engineering/Support/CAD | Leading to HTI circuit fabrication |
| Circuit Design | Layout from schematic |
| Circuit Conversion | Convert from PCB (G10/FR4) |
| Artwork Generation | For circuit pattern definition |
| Advanced Processes | Ceramic-based circuits / items |
| Packaging, Potting & Encapsulation | Ceramic, Glass Fiber Filled Plastic, Diallyx Phthalate |
| Ceramic Glass Sealing | Ceramic Packages |
| Photo Patterned Thick Film (Etched) | Fine Line Geometries (0.0015"):
-High Speed Circuits (>50GHz) -High Density Circuits -High Temperature Circuit |
| Plated up thick film circuits | High Current/High Power:
-Ni, Cu, Au |
The experienced team at Hybrid-Tek will work closely with you on your hybrid program from start to finish - from circuit design and layout assistance through final package assembly, testing, documentation and delivery - or any stage in between. You will have the assurance of the highest possible quality with 100% useful parts. Hybrid-Tek, Inc. has been setting the standard and leading the industry for 20+ years.
Hybrid-Tek, Inc. supports worldwide concerns that metals mined in conflict areas of the Democratic Republic of the Congo (DRC) may be making their way into the electronics supply chain. Our policy requires supply chain partners certify in writing they do not knowingly procure their material from conflict areas of the DRC.
We do everything within our power to comply with Section 1502 (the "Conflict Minerals Provision") of The Dodd-Frank Wall Street Reform and Consumer Protection Act to ensure that our materials are not only the finest quality but also ethically obtained. For more information please click here