Hybrid-Tek, Inc. Capabilities - thick film circuits. Capabilities...design, assembly, testing

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(609) 259-3355

CAPABILITIES

Capabilities	Applications

*Standard Processes*	thick film circuits on ceramic
Print & Fire	Circuit Fabrication
•single layer
•multi-layer
•double sided
Plated-thru Holes	available feature
Solid-filled Vias	available feature
Edge Coating	available feature
Resistor Trimming	available feature
Dielectric Crossovers	available feature

*Advanced Processes*	ceramic-based circuits / items
Photo Patterned Thick Film	Fine Line Geometries (0.001")
	•High Speed Circuits (>50GHz)
	•High Density Circuits
	•High Temperature Circuits
Circuit Plating	High Current/High Power
Packages	Custom Fabrication
Refractory Coatings	High-temp Environments

*Hybrid Assembly & Services*	ceramic, PCB, other board types
Surface Mounting •solder reflow	circuit populating - active & passive
Die Attach •wire bonding	circuit populating - semiconductors
Packaging & Potting	metal, ceramic, plastic
Laser Machining	substrate shaping, holes, slots
Diamond Sawing	substrate dicing

*Engineering / Support*	leading to HTI circuit fabrication
Circuit Design	layout from schematic
Circuit Conversion	convert from PCB (G10/FR4)
Artwork Generation	for circuit pattern definition

*Product Testing*	on HTI produced units
Continuity Testing	connection integrity
Resistor Measurement	value verification
Burn-in	circuit stabilization
Performance	design confirmation
Environmental	endurance verification